The Greater Ohio Chapter of the IPC Designers Council is hosting a
full day seminar on High Density Interconnect and Microvias by Mike
Fitts. Mike is an industry expert on HDI and has given seminars
worldwide, including a seminar at PCB West this March. Mike is a
member of the IPC subcommittee on HDI design responsible for IPC-2315
"Design Guide for HDI and Microvias" and IPC-226 "Design Standard for
HDI and Microvias".

For more information and a registration form:

http://www.ipc.org/cent-ohio/index.html
http://www.pcdmag.com/news/today/news.html#18

The seminar will be held in Dayton, Ohio on June 1. Registration for
the morning session will start at 8:30 AM. The presentation will
begin at 9:00 AM. Registration for the afternoon session will start
at 12:30 PM.

Directions will be provided with confirmation of registration or upon
request.

Checks should be payable to : IPC Greater Ohio Chapter.

Jeffrey A. McGlaughlin, C.I.D.
Sr. PCB Designer
Vice-Pres.. Greater Ohio Chpt of the IPC DC
Battelle Memorial Institute
Columbus Ohio
[log in to unmask]

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