Yes, the IPC is addressing BGA's.  The Surface Mount Land Pattern Design committee (SM-782) just met at PCEXPO this week.  We reviewed an addendum to the document which deals with BGA's exclusivly.  It's not ready for publication however if you contact Lisa Williams at IPC headquarters, she might put you on the dist. list.  She might be more receptive if you volunteer to help with the document or lend some input.
        If you get the document, bear in mind that it covers only JEDEC approved parts.
                                George Kotecki

----------
From:   Walter Williams[SMTP:[log in to unmask]]
Sent:   Thursday, April 30, 1998 12:07 PM
To:     [log in to unmask]
Subject:        [DC] BGA?

Hi Yall

Is the IPC currently working on some land pattern standards for BGA
components? I see BGA as an up and coming thing.


*************************************************
Thanks
Walter L. Williams, Circuit Board Designer
I-O Corporation, SLC, Utah
Industry leader in IBM AS400 connectivity products
[log in to unmask]
Voice: 1-801-972-3558 ex 123
Alternate: 1-801-973-6767
*************************************************
Carpe Diem

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