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1996

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Subject:
Question of the Day (QOD)
From:
Dieter Bergman <[log in to unmask]>
Date:
Fri, 12 Jan 1996 16:23:17 -0600 (CST)
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (44 lines) 

The following question is one that was provided by designers for
the  A  basic level exam. It is NOT included in the final
published test and is for reference only. The topic Component
Mounting.
    
*************************************************************
     
          113  Which side of the board should through-hole        

              components be mounted on, if the board is to be    

              machine (wave) soldered?
          
          A.   either side of the printed board
          B.   both sides of the printed board
          C.   the side that is in contact with the solder
          D.   the side opposite that which is in contact with 
               the solder

                                   select the most correct answer

     *********************************************************
Previous QOD

          112  How should the clearance be determined between a    
              non-functional land and a conductive plane that     
              surrounds the land?
          
                    C.   by maintaining clearance equal to the conductor
               spacing requirements
                    
Resource: IPC-T-50 Specific Terms and IPC-D-275 para 5.3.2.4;
5.3.2.5; figure 5-18.

          **************************************************************

Please send comments, constructive critique, or suggestions to
Lisa Williams at [log in to unmask] 

Dieter Bergman

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