Correct me if I'm wrong members, but the term "Tented Via" was coined when
dry film solder mask was popular.  The film was allowed to cover, but not
fill, the hole which both insulated it from adjacent copper features, and in
our use, negated inspection of the via holes in general.  It was good to use
when specifying the option of plating to the point of closure, i.e.. 0.012
+.001-.012.  Our inspectors would scrutinize untented vias that were
specified in this manner, and an argument usually ensued.  Covering them
solved the problem. No partially filled holes.  Nowadays with the use of
LPI, I guess the term "tenting" is a misnomer as the material will slump and
possible fill the hole rather than just covering it.  At a previous
employer, we first plugged the via holes with a liquid mask then covered
them with LPI. I'm presently using a 24/10 via and just mask over it with
LPI, so although while it's not tented, it accomplishes the same result.

Tom Hybiske
Bose Corporation
The Mountain
Framingham, MA 01701



> -----Original Message-----
> From: Karthik, P.V.S. (IE03x) [mailto:[log in to unmask]]
> Sent: Thursday, June 27, 2002 7:25 AM
> To: [log in to unmask]
> Subject: [DC] Tented Vias?
>
>
> Hello All,
>
> I would like to know what is a "Tented Via" and its application .
>
>

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