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Via Hole Filling Technology and Processes Webcast Series

Speaker:  Michael Carano, Electrochemicals, Inc.

 

An Overview

November 1, 2007

10:00 a.m. - 11:00 a.m. (CT)

 

The Rest of the Story

November 8, 2007 

10:00 a.m. - 11:00 a.m. (CT)

 

This IPC webcast series describes the technological drivers behind the
need for via filling in a highly effective and reliable fashion for high
density, high aspect ratio printed wiring boards. Close attention is
paid to the use of these via filling materials for highly complex
circuit designs.

 

For more information, or to register, please visit
www.ipc.org/ViaHoleWC.  For additional questions, contact Michelle
Michelotti at 847.597.2822 or e-mail at [log in to unmask]

 


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