Hello Designers,

I work for a medical OEM.  We will soon be producing RoHS-compliant
PCBA's.  I am not sure what exactly to include in the fab notes to
specify the PCB base materials for compatibility with lead-free assembly
temperatures.

For pre-RoHS boards I have included a note on the fab drawing that
specifies "FR4, copper-clad laminates" plus board thickness and UL
rating requirements.  Our boards are generally .062" thick and 8-layers
or less.  As far as I know, we've always used conventional FR4.

What would you suggest I include in a fab drawing note to assure that
the boards survive the higher assembly temperatures?  Is it enough to
specify decomposition temperature alone or should glass transition
temperature also be called out?  Td=330C?  Tg=150C?

I really appreciate your suggestions and advice.

Thank you.

Ted Klefisch, CID
Covidien
444 McDonnell Blvd.
Hazelwood, MO 63042

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