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| Date: | Mon, 16 Dec 1996 11:15:34 -0700 |
| Content-Type: | text/plain |
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Warning: Contains advise. Use with caution.... :)
I do extreemly tight boards. I have successfully used vias under, in,
partially in and .010" away (different nets). I use either a .030" pad
od/.016" +.003"/-.016" id or .020" pad od/.013" +.003"/-.013" id on fr4
with SMOBC (lpi). Vias must have mask over them to prevent shorts. Have
fun! -Ed
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From: [log in to unmask][SMTP:[log in to unmask]]
Sent: Monday, December 16, 1996 9:31 AM
To: [log in to unmask]
Subject: Des: Vias under caps amd res
I would like to know the pros and cons of putting vias under
capacitors and resistors. I was wondering what other designers
were doing. I have some designs coming up that I may need to put
vias where ever I can.
I have soldermask under my components, but not on the via
pads. I would maintain a .014 pad/pad clearance (.005
soldermask web). The via signal would not necessarily be the
same as the component pad signal.
Any information and wisdom will be greatly appreciated.
Thanks in advance!
Brandon Luther
Dataram Corp.
[log in to unmask]
(609) 799-0071 x310
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