Hi all of you,

Has anyone of you already implemented a BGA with pitch of 0.5mm, full matrix and 30 pins (6 rows, 5 columns) ?

Because in my case, the two inner most pins are not connected, it should be possible to avoid the use of laser or blind vias
by fanning out the two outer rows (and columns) ; 0.5mm pitch means e.g. solder lands of 8 mil diameter and
track width - clearance of 4mil (8 + 3times4 is 20 mil or about 0.5mm).
Anybody did it already in this way or is it maybe better to increase the solderland size at the expense of
clearance and track width ?

Thanks in advance for all responses.


Cor Coolen

Board Designer
Philips Medical Systems

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