When I design a board, I always take account of making 2 terminal SMT components equally thermally balanced. Reducing track widths when they exit SMT pads etc.
The assembly dept really like my boards, because they have very few problems with them.
Another chap making boards here, ignores thermal balancing of SMT components, connects the pads directly to the groundplane at one end without making the other end have similar amounts of copper exiting from it.
The assembly department hate his boards, they get lots of problems with them, component tombstone, move around etc.
The assembly dept may not be completely blameless in this, but thermal balancing does have it's part to play.
Matthew Lamkin.
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]]On Behalf Of Allen
T. Maddox
Sent: Wednesday, July 27, 2005 7:47 PM
To: [log in to unmask]
Subject: [DC] Trace width ratio to pad
Hey Folks,
I was always told to NOT exit a pad, especially a SMT pad, with a trace the same width of the pad for the reason of dissipating the heat off the pad and creating soldering issues.
I have an engineer who doesn't believe me and wants proof. Does anyone have any articles that support what I've been taught, or have I been mislead all these years?
Thanks,
Allen Maddox C.I.D.
Sr. PC Board Designer
GAI-Tronics, Corp
610-796-5854
PO Box 1060
Reading, PA 19607-1060
[log in to unmask]
www.gai-tronics.com
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