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1996

DesignerCouncil@IPC.ORG

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Subject:
From:
Dieter Bergman <[log in to unmask]>
Date:
Tue, 9 Jan 1996 11:06:37 -0600 (CST)
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (39 lines)
The following question is one that was provided by designers for
the  A  basic level exam. It is NOT included in the final
published test and is for reference only. The topic is Hole
Requirements...

     *************************************************************
     
          110    Given a maximum through-hole component lead
          diameter of 0.5 mm [.020"], what is the minimum
          finished plated through hole size that should be used?
          
                    A.   0.60 mm [.024"]
          B.   0.65 mm [.026"]
          C.   0.70 mm [.028"]          
          D.   0.75 mm [.030"]
                                   select the most correct answer

          *********************************************************
Previous QOD

          109    What is the most probable cause of a through-hole  
               multilayer board assembly repeatedly containing    
               defective joints on the power and ground           
               connections?
          
                    D.   component through-holes are not thermally relieved
          
     Resource: IPC-T-50 Specific Terms and IPC-D-275 para         
     5.3.2.3; figure 5-17

          *********************************************************

Please send comments, constructive critique, or suggestions to
Lisa Williams at [log in to unmask] 

Dieter Bergman



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