Subject: | |
From: | |
Reply To: | (Designers Council Forum) |
Date: | Mon, 12 Aug 2002 09:05:03 -0500 |
Content-Type: | text/plain |
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Hi,
I've been advised by the board house to add copper thieving to the outer
layers of a design we've sent them for manufacturing. I understand they
need to add copper in bare areas to allow them to plate evenly across
the board. We're considering a copper pour as opposed to sporatic field
oof copper squares...any suggestions, advice, comments?
Thanks for your input,
Kitty
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