The article was published in the June issue of Printed Circuit Design.  The article is named "Being first
matters" Describes how Thomson Electronics uses several methods to "do it right the first time" etc.
Including software that allows for pitch compensation during autoplacement.  Solder thieving pads for wave
solder, and silkscreen features on fine pitch components to stop solder bridging.  (How they impliment this
is what we have all been trying to figure out)  By the way your questions about registrations was my exact
question!  You are right on target!
Mike Gish
Sr. PCB Designer
Ditron Manufacturing, Inc.
Phoenix, AZ


Jack Olson wrote:

> Well, not that my experience means anything, but I have never seen that
> technique.
> I would think silkscreen registration is poor relative to the small space
> between fine-pitch pads, and even a slight error will screw up your
> assembly/soldering.
>
> I would like to know where that article was published,
> or hear from others who do it successfully.
>
> Jack
> (my employer stands behind every opinion I have.... <grin>)
>
>                 -----Original Message-----
>                 From:   Roberto Torres [mailto:[log in to unmask]]
>                 Re: Silkscreen feature in between fine pitch
>
>                 No one else uses the below mentioned silkscreen technique?
>
>                 On Wednesday, June 02, 1999 10:52 AM, Mike Gish Wrote:
>
>                                 I just finished reading an article that
> described adding
>                 silksreen
>                                 features in between pads on fine pitch
> components to create
>                 an
>                                 additional solder barrier between pads.
> Does anyone have
>                 any experience
>                                 doing this?
>
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