I forgot that many Designers are on work stations that don't read Microsoft
files very easily.  Below is the text of the meeting flyer.

Sorry for the inconvenience.

Bill


> All,
>
> Our next IPC meeting will be held jointly with the local Chapter of the
> ASME.  We will meet Feb. 24 at SUNY Binghamton for a presentation of
> electronic hardware teardowns being conducted by Rich Redolphy.  We had a
> similar meeting with Rich last year which was so well liked that people
> wanted to go back again for an update of new teardown activity.  The ASME
> was planning a similar meeting so we decided to collaborate on the same
> night.
>
> The ASME is having a dinner before the meeting starts.  The dinner is
> completely optional.  Details are in the attached flyer.
>
> If you want to attend the dinner please let me know so that we can get an
> accurate head count.
> If you plan on attending just the meeting and not the dinner let me know
> as well, so we have an idea of how many people to expect.
>
> It should be a good meeting.  I hope to see you there.
>
> Bill Dieffenbacher, SRC Secretary
> Lockheed Martin Control Systems                  Tel (607)770-2961
> 600 Main St. Rm R52                                    Fax(607)770-2056
> Johnson City, NY  13790       [log in to unmask]
>
>
> PS.  If you cannot read the attached flyer let me know and I'll get a copy
> in the mail to you.
>
>
> <<File: asme feb99.doc>>
>
>  February'99 Meeting - ASME Southern Tier
> & IPC Designers Council (Susquehanna Region)
>
> Electronics Packaging Tear Down
> Integrated Electronics Engineering Center, Binghamton University
>               Date:           February 24, 1999
>               Time:           6:30 PM (dinner buffet), 7:30 PM
> (presentation/tour)
>               Location:       Chenango Room, Science 1 Building
>                       Binghamton University, Binghamton, NY
>
> On Wednesday, February 24, 1998, there will be a presentation on
> electronics packaging Tear Down and tour of the Integrated Electronics
> Engineering Center (IEEC), Binghamton University, Binghamton, NY. This
> meeting will be a joint ASME and IPC Designers Council meeting. Bahgat
> Sammakia (IEEC Director) will give introduction on IEEC followed by a
> presentation of Electronics Packaging Teardown by Rich Redolphy. Rich
> Redolphy is responsible for consumer electronics product "teardown," the
> analysis of electronics packaging technology used in state-of-the-art
> consumer electronics products. He investigates new designs, components,
> processes, materials, and assemblies that are related to electronics
> packaging for new and soon to be released consumer electronic products.  A
> short tour of the IEEC laboratories is also planned.
>
> The IEEC, a research consortium in electronics packaging, is a New York
> State Center for Advanced Technology (CAT and a National Science
> Foundation State/Industry University Cooperative Research Center
> (S/IUCRC). The IEEC is an organized research center in the Thomas J.
> Watson School of Engineering and Applied Science at Binghamton University
> in Binghamton, New York. It was established in 1991 and pursues research
> in electronics packaging.
>
> Prior to the presentation there will be an optional dinner buffet. The
> cost of the buffet is $14. The buffet includes chicken breast, vegetable
> parmigian, breads and choice of desserts.  Please contact David Treacy
> (e-mail: [log in to unmask], phone: 607-974-1604) or Bill Dieffenbacher
> (e-mail: [log in to unmask], phone: 607-770-2961) by
> February 17, 1999 for reservations.
>
> Directions: follow Route 17 EAST to Exit 70 SOUTH (Route 201). Follow
> Route 201 and the SUNY signs to the traffic circle. Take first right off
> circle, crossing bridge to Route 434 EAST. The main entrance to campus is
> your first right (see attached map).
>
>

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