Hi,
This is the first time using a micro BGA package (256 lead,pitch 1mm) below
are some of my questions that anyone help me.
1) What  pad size to use for a good solder joint?
2) What is the best way to route and layers needed? Also the most cost
saving example microvia,blind/burried via ?
3) what trace width to use ?
4) Is it possible to route this BGA without using any via on pads ?
5) What are the instruction for pcb manufacturer.
6) Any one who have design this type of bga that can share your package or
show me your design. ( I'm a Pads user)
Tia.

Best Regards,
EILEEN ONG (R&D Dept.)
Paradise Innovations (Asia) Pte Ltd
25 Serangoon North Ave 5
6th floor Uraco Building
Singapore 554914
Did: (65) 485-6690 (Office)
Fax: (65) 481-2611
Email : mailto:[log in to unmask]
Web: http://www.paradisemmp.com