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| Reply To: | (Designers Council Forum) |
| Date: | Mon, 27 Jun 2016 16:52:00 +0000 |
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We use a note reading "MINIMUM HOLE WALL PLATING TO BE 0.001[25ėm] THICK IN ACCORDANCE WITH IPC-6010 SERIES SPECIFICATIONS FOR CLASS 3 REQUIREMENTS FOR COPPER PLATING." There is a pull down listing for 0.0008 [20ėm], 0.001[25ėm], and 0.002 [500.001[25ėm] above 0.002 need to be "As Agreed to ..." Remember to verify drill size and annular ring requirements are achievable with the heavier plating.
Thank you,
Jeffrey
Jeffrey McGlaughlin, C.I.D.
Engineering Designer
Mission and Defense Technologies
Office: 614.424.7582| Fax: 614.458.7582
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-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Hines, Kitty
Sent: Monday, June 27, 2016 12:38 PM
To: [log in to unmask]
Subject: [DC] Copper Thickness in Plated thru-holes
Good Morning,
I hope you are all doing well these days. I have a question I'm sure you can answer... What is the best way to define a min. value for copper thickness/weight in plated thru-holes? Specifically for Power boards that require more copper. I can refer to IPC docs for process and acceptability, but need to add a specific note to our Fabrication drawing calling for something close to 2 oz copper for plated holes.
Thanks in advance for your help,
Kitty
Kitty E Hines
ECAD Librarian/PCB Designer CID
576 Lamont Road
Elmhurst, IL 60126
(630) 279-3600 x6655
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