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Subject:	Re: Pad reduction for pb-free
From:	"Kipnis, Oleg" <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Mon, 24 Apr 2006 12:57:45 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (54 lines)

Read in latest SMT magazine (www.smtmag.com) article:
"SMT Land Patterns for Lead-free"

Regards,
OLEG KIPNIS
x8286

PCB Layout Designer
SMART  Modular Technologies, Inc.
4211 Starboard Drive
Fremont, CA 94538
Direct: 510-624-8286    Fax: 510-624-8195


-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]]On Behalf Of
Holmes Ben-CBH033
Sent: Monday, April 24, 2006 12:50 PM
To: [log in to unmask]
Subject: [DC] Pad reduction for pb-free


Hello All, can anyone refer me to any feasibility studies or
recommendations
on pad size reduction for lead free assembly?
 
Regards,

Benjamin C. Holmes C.I.D. 
Senior Substrate Designer 
Motorola Networks & Enterprise 
Office: 770-338-3278 
eFax: 847-761-1636

 

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