Doug,

The main publication that I have been using is the SMTA (Surface Mount
Technology Association) TP - 101A, revision May 1994.  I looked in seeing if
they had a more current revision about a year ago, they said that was the
latest.

Thanks,
Greg Kaskey

> -----Original Message-----
> From: Doug Shawver [SMTP:[log in to unmask]]
> Sent: Tuesday, January 19, 1999 2:51 PM
> To:   [log in to unmask]
> Subject:      [DC] Rigid PWB, ICT probe pad air gap requirements
>
> The following questions relate to ICT (In Circuit Test) of assembled rigid
> PWB's
> using conventional .050", .075" or .100" probes used in test fixtures.
> (Flying probes
> are not of interest due to volume of units built).
>
> 1) Is there an industry specification that address the air gap required
> from the edge
> of ICT test pads to SMT component body's and/or component pads?
>
> My dilemma: IPC-SM-782 section 5.7.2 states: "Test lands should be .025
> minimum
> from mounting land areas." This does not specify the spacing from the
> component
> body nor does it seem sufficient to the land areas. Our vendors use
> IPC-A-610 to
> inspect assembled boards. If the assembly is class III and a 1206 resistor
> is on the
> board IPC-SM-782 section 5.7.2 would seem to allow a test pad to be .010"
> under
> the part. Obviously, this is not what we want.
>
> 2) Is there another industry specification such as IPC, Bellcore, etc.
> that
> addresses this
> issue? If so, please indicate the specification #. If you have an internal
> specification that
> addresses this issue I would be grateful if you could share what your
> parameters are.
>
> 3) Is there a specification that defines the probe pin accuracy or
> location
> tolerance of
> .050", .075" and .100" probes used in a "standard" ICT test fixture?
>
> I've been reading IPC's tech-net and design-net mail for years and there
> is
> a wealth of
> knowledge in this mailing list.
>
> Thanks for any help you can provide.
> Doug
>
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