LISTSERV - DESIGNERCOUNCIL Archives

DESIGNERCOUNCIL Archives

February 2004

DesignerCouncil@IPC.ORG

	LISTSERV Archives
	DESIGNERCOUNCIL Home
	DESIGNERCOUNCIL February 2004

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Pad to exposed Copper spacing
From:	Fred Dark <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Thu, 12 Feb 2004 13:58:25 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (18 lines)

Can some one tell me the IPC standard and where to find info. on a through
hole component pad to a copper pour "exposed" area (no solder mask). The
issue in my design is designing in a "spark gap" that has a solder pad next
to a piece of exposed copper and I need to know from a manufacturing point,
with wave soldering and or reflow what would be the IPC recommended spacing
to avoid solder bridging.

Regard's, Fred Dark Jr.

---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG