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Subject:	IPC 2221
From:	Dave Sharples <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Thu, 25 Jul 2002 06:04:04 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (31 lines)

Hi,

I do not have quick access to ICP 275 and IPC 2221.

I am told by my PCB supplier that the distance from hole edge to pad edge
should not be less than 0.5 mm in IPC 275 and 0.6 mm in IPC 2221 for the
design of through hole vias.

If this is so how do you fanout fine pitch BGA components or even 35 mil
pads on 50 mil pitch.

Is there a tolerance on missregistration in the Mil 55110 spec.

Your help will be most appreciated.

Regards,

Dave Sharples
www.pcbdesign.co.za
+ 27 (0) 72 397 5824

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