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Subject:	Re: .5mm BGA fanout
From:	Patrick Jabbaz <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Thu, 10 May 2007 11:59:31 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (46 lines)

Bruce,
I mean all the way trough, no stacked vias, I know Cortec-inc can do 
microvias all the way through on 40 mils and 60 mils board thickness, 
check with your shop. That's what I did, in this case I did not want to 
use staked vias. And I checked with the FAB house if the design needed 
to change I also gave them the option of reducing the board thickness 
from  60 mils to 40 mils, and I was told the design was OK for their 
capabilities. Not sure what process they use, I had to Pay double from 
what I normally pay for a 6 layer board.
I have done stacked vias in the past, by having blind microvias L1 to L2 
and then blind vias from L2 TO L10 on a 10 Layer board.

-Patrick

Bruce Fortnam wrote:
> When you say "micro vias all the way through top to bottom layer", do you
> mean stacked microvias - i.e. the ALIVH process or DDI's SMV?
>
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-- 
Patrick Jabbaz
Ubiquiti Networks
495-499 Montague Expwy
Milpitas, CA 95035
T: (408) 942-3085
M: (408) 621-6533 

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