Fellow designers;

The IPC Designers Council Education committee has completed the objectives
for the Advanced Printed Wiring Board Design level of certification. These
objectives will be used to create a study guide, and eventually the questions
for the examination. We wish to share these objectives with you, and solicit
your comments. Comments should be constructive, and include recommendations
for improvement, inclusion, or exclusion. The objectives will cover the ten
major subject areas: 

Layout
Electrical considerations
Material properties
Component requirements
Assembly technology
Board fabrication
Physical board requirements
Documentation
Testing technology
Reliability
	 
The four bullets, within each objective, are suggestions for topics that may
be covered by that objective. These bullet items are by no means all
inclusive, but are used to provoke thought on the topic.

In addition, we ask for any technical inputs for inclusion in the study
guide. You may believe that there are critical issues that need to be
covered, and this information is extremely valuable to us. We will accept any
input from a finished paragraph to an outline of critical issues.

So as not to overwhelm you with all fifty-six objectives, at one time, we
will be releasing them in small groups of no more than six.

Please send all comments to Jeanne Cooney at: [log in to unmask]         

LAYOUT

1B.1	Apply design standards to meet manufacturing and assembly goals.	
		
        ..Recognize manufacturing and assembly cost trade-offs
        ..Identify characteristics for robust assembly
        ..Illustrate check list for high first pass yields
        ..Demonstrate use of applicable standards

1B.2	Distinguish complete description of parts, quantities, manufacturers
code   
         and special ordering instructions from an 
         engineering provided material list.

         ..Describe the purpose of using standard components
         ..Describe the reason for having a complete parts list
         ..Describe the difference between standard/nonstandard parts
         ..Explain who and why the parts list needs approval

1B.3	Identify PCB panelization strategy compatible with the 
         manufacturing processes.

         ..Describe manufacturing allowances and tolerancing principles
         ..Explain how to calculate maximum board to panel size 
           relationship
         ..Explain the need for a fabrication allowance on the panel
         ..Describe the cost trade-offs between various panel sizes

1B.4	Make a density evaluation.

        ..Identify the characteristics to use in a density analysis
        ..Explain why density evaluations are important
        ..Explain what constitutes a usable board area
        ..Explain what constitutes the component area

1B.5	Develop strategy for board type selection based on end product 
         performance.
 
        ..Define check list of properties to make board selection
        ..Explain the need for test considerations on the check list
        ..Identify the temperature ranges for end use environments
        ..Establish throw-away concepts related to cost of repair


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