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| Reply To: | (Designers Council Forum) |
| Date: | Thu, 9 Jun 2011 13:57:30 -0400 |
| Content-Type: | text/plain |
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Hi Tom,
You may have already seen this, but this is a good paper comparing underfill
and corner bonding CSP's.
http://www.eng.auburn.edu/ee/leap/files/Corner_Bond_CSP.pdf
Corner bonding is not as good as underfilling, but is good enough for most
commercial consumer electronics.
Steve
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Tom
Stearns
Sent: Thursday, June 09, 2011 1:15 PM
To: [log in to unmask]
Subject: Re: [DC] Corner bonding
Steve:
Do you have comparative data for corner bonding vs underfill in high shock
environment?
T H Stearns
3 Brander Court
Nashua, NH 03063
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