Hi Jack-
Good question; no answer from me, but...
Just out of curiosity, what do you see as being "the surface of the board"?
If you're worried about a mil or two of solder, then the difference between
bare laminate vs. base conductor+ plating+finish vs. either/both with
soldermask added becomes significant... I only ask because that comes up
from time to time here. My answer is: "It depends... why do you ask?"
Since the board thickness usually has a 10% tolerance, if it's 1.5MM or
thicker PCB, I'd just leave solder under the connector out of the stackup,
but I'm lazy that way.
And I guess the connector config. would have a lot to do with it. Does it
have a mechanical retaining feature? If so, I say disregard the solder.
It's gonna be where it's gonna be within the tol. built into the snap,
lock, or whatnot.
-Chris
"Jack C. Olson"
<[log in to unmask]> To: [log in to unmask]
Sent by: DesignerCouncil cc:
<[log in to unmask]> Subject: [DC] Floating SMT components?
03/18/2005 12:08 PM
Please respond to
"(Designers Council
Forum)"; Please respond to
"Jack C. Olson"
I have been asked a question that I've never read anything about before, so
I'm hoping someone will know this...
We have a mechanical engineer who is trying to predict the distance between
boards after soldering SMT board-to-board connectors. We know the connector
mating height, but the question is:
"If the connector is sitting in solder-paste, how high will it stay above
the surface of the board?"
Common sense tells me the connector will not be flush to the surface, there
will be some solder under there, and I think we are using 6mil paste
screens. Has anyone had to document something like this before?
Jack
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