Dear Designer Council,
I have recently joined a company which is having great difficulty with
soldering on a QFN part. The main trouble is solder voids under the
component leads, resulting in opens or intermittent operation. One thing I
noticed is that this particular layout has a silkscreen outline under the
part, between the lead lands and the thermal land. I would think silkscreen
under a QFN would be a bad idea. What is the prevailing wisdom regarding
this in the layout world?

Thank you,
Heather Gregg


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