Hi.,


    For fine pitch QFP and SOP components (.5 mm or less) which type of solder mask is preferred in a fab point of view ? Gang solder mask or individual pin/pad mask ?


regards,
Oommen Mathews

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Sr. Engineer - VLSI/System Design,

Wipro Technologies Global R & D,

Tower-4/First Floor/Wing-A,

#72, Keonics, Electronics City,

Hosur Main Road,

Bangalore - 560 100. India

Tel:+91 (0)80 8520408 Ext:4132

Res:+91 (0)80 6659004

email: <[log in to unmask]>

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