Design for Assembly Workshop
November 12-13, 2007 - Houston, TX

Instructor:  Gary Roper, Roper Resources & Dieter Bergman, IPC

 

Designing printed boards is more difficult today than ever before.
Printed board designers are faced with the continuing design issues of
surface mount vs. through hole technology, what materials to use, board
size and layer count, how to incorporate electrical testing, what new
specifications are being used in the design process and many other
topics.

The course will address trade-offs for designs that have both
through-hole and surface mount components. The tolerance characteristics
that make sense using the capabilities of today's manufacturing
equipment will also be discussed. Attendees will have a unique
opportunity to obtain first hand information on design issues that
affect manufacture.

Register early and save 10% off the current registration fee or take
advantage of our special offer - register three participants and get
fourth free!  For more information or to register, please cut and paste
www.ipc.org/DFA1107 <http://www.ipc.org/DFA1107>  into your browser and
download the registration form.

 


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