DESIGNERCOUNCIL Archives

May 1999

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Subject:
From:
Bob Landman <[log in to unmask]>
Reply To:
Bob Landman <[log in to unmask]>
Date:
Sat, 8 May 1999 09:42:02 -0400
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Jack,

This is news to me!  We never remove unconnected pads from inner layers.  Why
bother?  I suppose if density was a serious problem and you were trying to
squeeze an extra trace between pads, it would matter but it's a lot of work.
This means a lot of hand work in ECAM on the gerbers- yuk.  We don't do this nor
do our contract designers.

I don't know if our board vendor does this so I'm copying this e-mail to him to
let him respond directly to you and the forum.

Bob Landman
H&L

-----Original Message-----
From: Jack Olson <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: May 07, 1999 3:25 PM
Subject: [DC] Unconnected inner-layer pads


>It seems that most fabrication vendors prefer to remove the unconnected pads
>from inner-layers, in fact we do it for them before we send out the gerbers.
>
>But I thought I overheard Gary Ferrari say there was some test results that
>showed the board to be more reliable with all pads included, but I don't
>know where to find it or who did the testing.
>
>Does anyone know if it is significant enough to re-evaluate our process?
>
>Jack
>
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