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May 2007

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Subject:
From:
Huss Volkmar <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Thu, 10 May 2007 18:23:00 +0200
Content-Type:
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text/plain (128 lines)
Since the edges of the traces slope down somewhat, due to the etching
process, I would prefer one trace with twice the single width over 2
traces set apart. 
If inductance is a topic, as ist sometimes is with high currents, and I
remember it correctly, L will also be less for a single trace twice as
wide compared to two traces of a single width. 

But to answer your original question, I would check number 2). The wider
the better. The charts predict a temperature rise based on thickness and
width. From an ambient point of view, two traces that are close together
can be seen as one, the width of which is the sum of the individual
widths, multiplied with a factor <1 e.g. 0.75.

Cheers,

  Volkmar

Volkmar Huss, C.I.D.
Prettl Elektronik Luebeck GmbH


-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Jack
Olson
Sent: Thursday, May 10, 2007 4:54 PM
To: [log in to unmask]
Subject: Re: [DC] Current vs. Temperature (IPC vs. PCBTEMP)

Thanks for explaining to everyone how unique my "challenge"
is, but I would think others have faced similar situations.
I'm not really asking anyone to solve my problem for me, and it this
unique application doesn't really warrant buying and learning a thermal
simulator, but it just makes me wonder how other people treat the
problem.
Many people I'm sure have multiple currents on a board.
(I don't think ALL of us are doing 2.5V digital designs)

If you assume the chart or calculator is for a single trace, and you
have TWO traces, do you:
1) use the single trace values?
2) increase the width a little?
3) try to leave space between them?
4) simulate it?

So its kind of a POLL.
What do YOU do?

just curious,
Jack






On 5/9/07, Brooks,Bill <[log in to unmask]> wrote:
>
> Generally most boards do not have the same conditions that Jack is 
> describing to the group. This is a specialized application and I would

> recommend doing a thermal model of the board before making any 
> assumptions.
> We use a program called ICEPACK
>
> (http://www.ansys.com/products/icepak/default.asp )
>
> along with our Solidworks 3D model of the board assembly which is a 
> direct output from the Altium Designer board design program and we can

> plug thermal temp and conductivity values into the board assembly and 
> predict what the temps will be at any given ambient in any enclosure 
> we design.
>
> The challenge facing Jack is predicting what the total load of heat 
> will raise the temperature to hoping of course that it does not exceed

> the Tg of the board material.
>
>
> Bill Brooks
> PCB Design Engineer, C.I.D.+
> Tel: (760)597-1500 Fax: (760)597-1510
> Datron World Communications, Inc.
> Vista, California
>
>
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