I need to find out if there is an IPC spec that covers beveling (edge   
chamfer) for gold fingers (printed edge board contacts) that are   
panelized internal to the panel, i.e. not on the panel edge.

We panelize all boards on a standard panel (for us) and from time to time   
that means we have edge fingers internal to the panel (or we have massive   
material waste).  We have tried numerous methods - scoring the edge   
(results in less than optimal bevel/chamfer), leaving a min. of .300   
between images so the panel could be routed out in that area and a   
special tool used for beveling (results in material waste), using a   
special scoring tool to bevel (not all manufacturers have the tool or   
capability).  Is there a standard?  Is there a spec?  What are y'all   
doing?

thanks for any help....

Ben
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