DESIGNERCOUNCIL Archives

January 1999

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Subject:
FAB Gold plating for wire bonding
From:
Gary Shoemaker <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Thu, 28 Jan 1999 19:38:59 -0500
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text/plain
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Hello everyone,

I have a couple questions about the different methods of gold plating
wire bond pads. What are the pros and cons of electroless versus
electrolytic gold deposition? Are there any other methods of gold
plating being used successfully for wire bonding applications? Thanks in
advance for all your help.

Gary

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