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| Reply To: | DesignerCouncil E-Mail Forum. |
| Date: | Thu, 30 Apr 1998 10:58:31 -0400 |
| Content-Type: | text/plain |
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The market trend seems to lean towards laser ablated blind MicroVias due
to the lowest cost and fastest process. I know that Hadco is among the
leaders in this process. Contact Joe Gibson at [log in to unmask] for
more info.
Chris Taylor
Senior Printed Circuit Designer
LXE, Inc.
125 Technology Parkway
Norcross, GA 30092
voice: (770) 447-4224 X3242
fax: (770) 447-6928
[log in to unmask]
>----------
>From: JEREMY CHEN[SMTP:[log in to unmask]]
>Sent: Thursday, April 30, 1998 10:43 AM
>To: [log in to unmask]
>Subject: [DC] Blind Via hole for Depth control
>
>Dear everybody:
> Who can help me what is Depth control to hole depth accuracy for
>blind via hole?
>and how to control it ? What is blind via hole for HDI trend? Cap
>lamination or depth control or laser via or Photovia ? How about market?
>
> Thank regards
>
> Jeremy H.C Chen April 30 1998
>
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