I was reading an article by Rich Trine from 2005 in Circuitree Magazine
about the subject of Lamination of PTFE based materials for multilayer
PCB applications... 

http://www.circuitree.com/Articles/Feature_Article/8a007da6a80f7010VgnVC
M100000f932a8c0____

I'm curious if anyone has any experience with this subject and could
explain the ins and outs of choosing to make a sequential laminated
multilayer construction with PTFE and polyimide materials combined. 

Have things become any easier than the article seems to suggest? 
What would be the limit of sequential laminations you would do? How
would you deal with the different CTE properties? Also, how would you
deal with  the differences in the temperature requirements for bonding
of the thermosetting prepregs?? 

Anyone done anything like this before? How did it turn out? 
Where can I find more research on the subject?
 
Bill Brooks | Datron World Communications, Inc.
PCB Designer/Engineer | Office: 760-602-7004| Fax: 760-597-3777 |
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3055 Enterprise Court, Vista, CA 92081 | www.dtwc.com

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