I am searching for any data out in the industry referencing the affects
of conformal coatings on BGA devices?

1. How much coating should be allowed under the device?
2. Should the underside of the BGA be completely dammed or underfilled?

I have collected test data that shows standard spraying of coating material
does not affect life cycle, but allowing complete underfill of the coating
material greatly reduces life cycle.

3. What concerns are there for leaving exposed adjacent uncoated conductors
(BGA balls) under the BGA
devices (per IPC J-Std-001 C paragraph 10.1.2.2 - d. "......freee of
voids..........which expose component conductors......" this is not
allowed)? Are they including BGA type devices in this requirement?

My specific application is with type UR coating but I would appreciate ANY
data!

Any data you could find me in this area would be greatly appreciated
Thanks for your time,


-----------------------
Karen McConnell
Lockheed Martin, EPICenter
1 Federal St., Camden, NJ 08102
Email: [log in to unmask]
Phone: (856) 338-3292
Fax:   (856) 338-2967

---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------