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| From: | |
| Reply To: | (Designers Council Forum) |
| Date: | Mon, 26 Jul 2004 13:47:40 -0500 |
| Content-Type: | text/plain |
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Ihave never worked for a company
that used such thin dielectrics, sorry.
I'm dying to know why you are pushing that limit,
I mean what application is it for...?
Jack
Susan Mansilla
<[log in to unmask]
>
Sent by: To
DesignerCouncil To
<DesignerCouncil@ [log in to unmask]
ipc.org> cc
07/23/2004 12:43
PM
Subject
Please respond to [DC] Dielectric limits
"(Designers
Council Forum)"
<DesignerCouncil@
IPC.ORG>; Please
respond to
[log in to unmask]
Caterpillar: Confidential Green Retain Until: 08/22/2004
Retention Category: G90 -
General
Matters/Administration
This is the question I sent before - we really need your input so that what
we put into the board specifications is correct. Please respond
Good Morning
In the current rigid board spec 6012A and in 6012B, soon to be released,
there is a note in the Dielectric Thickness para that states: "Minimum
dielectric
spacing may be specificed to be 30 um (0.00118"); however, low profile
copper
foils should be used and the voltages employed should be taken into
consideration so as not to cause breakdown between layers....When the
nominal
dielectric thickness on the drawing is less than 90 um (0.0035"), the
minimum
dielectric spacing is 30 um (0.00118").
I have had advice from some that the thinner dielectric is for "special"
materials and not the routine epoxy and polyimide materials typically used.
Where is there guidance as to what materials can be taken down to 1 mil
between layers?
Thanks for any help you can provide.
Susan Mansilla
Robisan Lab
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