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Subject:	Stress on solder joints on fine pitch components caused by keypad action
From:	E Mac <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Tue, 19 Jul 2005 22:47:06 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (20 lines)

Investigating a PCB design which implements a keypad design with fine pitch BGAs and TSOP ICs. My concern is possible  stress and vibrations induced by the keypad operation could transfer stress to the solder joints of the fine pitch IC causing the weakening of their solder joints.

Does anyone have experience how to model the stresses on solder joints?



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