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Subject:	Re: Swiss Cheese pour better that solid pour article
From:	"McGlaughlin, Jeffrey A" <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Thu, 29 Oct 2009 16:15:21 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

I remember an article on this published in EDN Magazine sometime around 1997 based on TO-220 and D2PAK style components. Hope this helps.

Jeffrey A McGlaughlin, CID
Engineering Designer/EAS
Room 4-2-50
Phone (614)424-7582

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of SUBSCRIBE DesignerCouncil wheels
Sent: Thursday, October 29, 2009 2:39 PM
To: [log in to unmask]
Subject: [DC] Swiss Cheese pour better that solid pour article

Guys,

A EE there had convinced us to take small pours that connect to a tabs of a 
SOT-223 and add vias to the pour. Mind you that the pour were not gnd and 
had no reason to connect to a opposite side pour. The claim was that having 
holes in the board would help dissipate heat by air flow. I thought he was 
crazy. Then I saw an article that supported his claim. I can seem to find it 
now. Anyone remember seeing it. I think it was publish this year.


John

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