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April 2006

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Subject:
From:
Karl Bates <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Thu, 13 Apr 2006 18:24:28 -0500
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It's also easier to assemble, with less likelihood of shorting between the
conductors (given you use the correct land pattern and spacing of vias etc.)
Karl


From: David Baldwin <[log in to unmask]>
Reply-To: "(Designers Council Forum)" <[log in to unmask]>,
  David Baldwin <[log in to unmask]>
To: [log in to unmask]
Subject: [DC] BGA vs. QFP
Date: Thu, 13 Apr 2006 14:54:39 -0700

Fellow Designers / Engineers:

I have always believed this blanket statement:

"A BGA will always provide superior performance to a QFP due to the
powers / grounds being closer to the die, shorter wire bonding, and
the absence of lead inductance"

Is this a true statement or are there other considerations that I am
missing?

TIA.

David Baldwin C.I.D.+
______________________
Baldwin Tech Institute LLC
1736 S. Nevada Way
Mesa AZ  85204
(480) 539-4400
www.Baldwin-Tech.com

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