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Reply To: | (Designers Council Forum) |
Date: | Thu, 13 Apr 2006 18:24:28 -0500 |
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It's also easier to assemble, with less likelihood of shorting between the
conductors (given you use the correct land pattern and spacing of vias etc.)
Karl
From: David Baldwin <[log in to unmask]>
Reply-To: "(Designers Council Forum)" <[log in to unmask]>,
David Baldwin <[log in to unmask]>
To: [log in to unmask]
Subject: [DC] BGA vs. QFP
Date: Thu, 13 Apr 2006 14:54:39 -0700
Fellow Designers / Engineers:
I have always believed this blanket statement:
"A BGA will always provide superior performance to a QFP due to the
powers / grounds being closer to the die, shorter wire bonding, and
the absence of lead inductance"
Is this a true statement or are there other considerations that I am
missing?
TIA.
David Baldwin C.I.D.+
______________________
Baldwin Tech Institute LLC
1736 S. Nevada Way
Mesa AZ 85204
(480) 539-4400
www.Baldwin-Tech.com
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