What a truly revolutionary practice ... using planes on PCB outer layers !!

I'll file that one the same place I filed the patent on fanning out BGAs.


> 
> From: DesignerCouncil automatic digest system <[log in to unmask]>
> Date: 2007/06/21 Thu AM 12:00:12 CDT
> To: [log in to unmask]
> Subject: DesignerCouncil Digest - 18 Jun 2007 to 20 Jun 2007 (#2007-119)
> 
> 

Dave Schaefer
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Apologies if this has already been posted, I just came across it trying to find
some info on removing via pads on internal layers (can anyone point to any articles for why/why not to do this?)

The first hit on a Google search for "suppressing vias internal layers pcb" was this:

http://www.patentstorm.us/patents/7016198.html

eh? 

Matthew