Thanks Jack - Ill take that..!
Regard's, Frederick Dark Jr.
Manager Senior PCB Designer
Crestron Electronics, Inc.
22 Link Drive Rockleigh N.J. 07647
P:201.750.7004 ext.11320
F:210.767.5772
[log in to unmask]<mailto:[log in to unmask]>
________________________________
From: Jack Olson [mailto:[log in to unmask]]
Sent: Wednesday, February 29, 2012 10:08 AM
To: (Designers Council Forum); Fred Dark
Subject: Re: [DC] BGA and pad size per IPC
Sorry for the delay, but according to IPC-7095 section 6.2
(Design and Assembly Process Implementation for BGAs)
the land sizes are 20-25% smaller diameter than the balls.
It ALSO says "A general rule is to design the solder land
on the board with the same diameter as the land on the BGA
substrate" (the lands that the balls are attached to).
I think this would keep the ball a symmetrical shape as it
collapses and surface tension takes over, so it makes sense
to me.
I haven't heard any complaints about the two different kinds of
advice, so I assume they correspond well enough that no one
is screaming for a change.
hope that helps,
Jack
On Thu, Feb 23, 2012 at 4:01 PM, Fred Dark <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Hi All - BGA's pad size determination, is it still per the nominal ball size minus the percentage(IPC-7351)..? we have been designing pads per the nominal ball size minus the percentage, however a Ee mentioned using the max ball size minus the percentage... is this true \ recommended to date per IPC..? where can I find this in a IPC manual...?
Regard's, Frederick Dark Jr.
Manager Senior PCB Designer
Crestron Electronics, Inc.
22 Link Drive Rockleigh N.J. 07647
P:201.750.7004 ext.11320<tel:201.750.7004%20ext.11320>
F:210.767.5772<tel:210.767.5772>
[log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>>
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