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1996

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Subject:
From:
"Ofer Segal" <[log in to unmask]>
Date:
Thu, 29 Feb 96 17:21:02 EST
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     Maik,
     we design Surface mount land pattern for our board and for resistors   
   &  capacitors, the width of the pad is greater than the width of the >       
   part. in order to reduce the among of the paste we reduce the opening on the 
     screen.

                ofer segal (scitex-israel)
______________________________ Reply Separator _________________________________
Subject: Re: Surface mount land patterns
Author:  [log in to unmask] at INTERNET
Date:    28/02/96 04:41 PM


At 04:48 PM 2/27/96 -0800, you wrote: 
>
><Text_1>
>       Our company just started using surface mount components and as I'm 
>     creating the land patterns, I notice that on the resistors &
>     capacitors, the width of the part is greater than the width of the 
>     pad. What is the reason for this and would it cause a problem if I 
>     made the pad the same size as the part?
>
>     Thanks,
>     Mike Wedlock
>     Aerospace Avionics
>
>
Mike;
     
It was noticed that on some of the larger chip components, that the volume 
of solder was too great. This volume caused some cracking of the component 
during the soldering process. To reduce this volume, the land pattern width 
was reduced.
     
Gary Ferrari
Tech Circuits
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