Silver Hole Fill is achieved on PTH holes by filling the hole with a
conductive silver epoxy paste. This allows for a via in pad technology that
is utilized on many of the semiconductor ATE type of boards where a test pin
is constantly probing and making contact with that surface. Usually silver
is specified for its conductive properties and a very smooth and flat
surface that is required for the pins or balls to make a connection to the
other device.

We use a Dupont CB100 Silver Epoxy paste.
It is not an easy process and it is not cheap!

Best Regards,

Paul Olson
V.P. Sales & Marketing
Taylor Technologies, Inc.
512-365-2244, x14 Tel
512-365-2255 Fax
www.TaylorTechnologiesInc.com


-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]]On Behalf Of
jblier
Sent: Tuesday, February 05, 2002 10:17 AM
To: [log in to unmask]
Subject: [DC] Silver through hole technology


Hello!

I'm looking into something called silver through hole technology.

Could any of you give me inputs, opinions or  personal experience with
this technology?

Is it any good or it's more trouble then it's worth?

Thanks,

--

Jimmy Blier
CAD Department. (Senior Cad Designer)
P A R A D O X
S E C U R I T Y      S Y S T E M S
Email: [log in to unmask]

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