Hello Doug...

          We have used 782 for 2-3 years for SMT land design.
          Not all footprints are in this spec, but can be created
          based upon guidelines in the specification (some chip
          fabricators seem to pull plastic pkgs from the nether
          regions when designing, their pkg's are not always common to
          IPC/JEDEC).

          Best way is to purchase the latest revision of 782 from IPC
          and compare it to some of the common land patterns you use
          currently (discretes/PLCC's/QFP/TSOP's/etc.). The spec is a
          fairly complete book that costs $25-40.00 (??), and it has
          proven very helpful.  We have also decided in the last year
          to also subscribe to JEDEC for additional pkg specifications
          (Global Eng. Documents).

          We are in a very high pcs/month range, and have had no
          problems with handling/solderability of IPC designed
          f.prints.

          >>> You might also consider IPC-A-610 for manuf. info, very
          good-has saved my butt a couple times with Assy. vendors.

          Oh Yeah...
          If we do not find our part f.print in 782, we then check
          JEDEC, if its not in JEDEC, we reference the pad creation
          rules in 782.

          Hope this helps, or if additional ??,
          [log in to unmask]

          Les Beller
          EchoStar/Englewood, Co.
          Home of the Dish Network!

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