Jack,
What a great topic for concern.
Manual soldering is to say the least, traumatic to PCB materials.
A lot will depend on how good and diligent those doing the soldering  are.
The material will likely be fine if it doesn't get overheated by the  iron.
My suggestion would be to use the condition of the copper as an  indicator.
If the process causes copper lift or wrinkle then it may be getting to hot  
for the substrate.
Are these protos or field units?
If protos, then they could be allowed a little more abuse as long term  
reliability is not as big a factor.
If this is just happening during process development then the actual  
customer units should have less hand work.
Lots of variables, so you kinda have to weigh the abuse with the  results.
Look closely for delam and if you can't find any then go forward.
Changing material could cause a performance change that is not preferred so 
 stick with what you have if you can.
Good Luck,
FNK
 
Frank N Kimmey CID+
 
 
 
In a message dated 2/2/2016 11:30:46 A.M. Pacific Standard Time,  
[log in to unmask] writes:

We use  bare board materials that meet or exceed the requirements of
IPC-4101/129  by default, but if we had a design that required MANY manual
soldering and  de-soldering operations (at least in the beginning), should I
recommend a  different material?
I don't know much about manual soldering and what it  does to the bare 
board.
Is there a commonly-used material for this kind of  abuse, or is /129 good
enough?

feeling grateful for IPC  forums..
I don't even know where else I could ask this  question,
Jack


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