Unless I'm reading it wrong, it looks like you have more than 12mils between
pads, so that would not be an issue.
The ,6mm (23.6mils) dimension is hard to evaluate without knowing the height
of the component.
From somewhere I remember (sorry for not having references) that if you take
the MAXIMUM size (width) of the component, make sure the pad is sticking out
past it by at least half the maximum height (are those castellated leads?)
to ensure an appropriate solder fillet geometry.
Take the MINIMUM size of the component together with the MAXIMUM
metallization on the underside of the component, and make sure the pad under
the component extends underneath enough to make a decent solder fillet at
the heel. (Some say the heel fillet provides more mechanical strength than
the toe)
hope that helps a LITTLE bit...
Good Luck,
Jack
-----Original Message-----
From: Mark Gilbert [mailto:[log in to unmask]]
Sent: Monday, September 25, 2000 1:16 PM
To: [log in to unmask]
Subject: FW: Pad Layout Question
<< File: PadLayout.bmp >> Here is the attachment I had tried to post on the
forum. Please take a look
and comment. Thank you for your response.
<<PadLayout.bmp>>
Regards,
Mark Gilbert, Product/Process Engineer
FOX Electronics
For Frequency Control Solutions. . . Fast:
1-888-GET2FOX, ext. 289
Fax: 941-693-1554
http://www.foxonline.com/
-----Original Message-----
From: Olson, Jack [mailto:[log in to unmask]]
Sent: Monday, September 25, 2000 4:14 PM
To: 'DesignerCouncil E-Mail Forum.'; 'Mark Gilbert'
Subject: RE: [DC] Pad Layout Question
This is the first time I can ever remember a manufacturer asking for input
from designers.
You should get a standing ovation....
THANK YOU!
Jack
(p.s. unfortunately, file attachments don't come thru the server, but thanks
for caring)
-----Original Message-----
From: Mark Gilbert [mailto:[log in to unmask]]
Sent: Monday, September 25, 2000 12:19 PM
To: [log in to unmask]
Subject: [DC] Pad Layout Question
My company is a manufacturer of oscillators and I have some questions
regarding appropriate pad/lead layout. I am not a design engineer and seek
advice. Attached is a copy of the proposed layout. Given the small
dimensions and the spacing between solder areas, there is concern of
problems with manufacturability. I have two questions: 1.) Does anyone see
any issues with this current layout and 2.) If the 0.600 dimension (penciled
in by hand) is shortened to any degree, would this be a problem? Please
advise, thank you.
<<PadLayout.bmp>>
Regards,
Mark Gilbert, Product/Process Engineer
FOX Electronics
For Frequency Control Solutions. . . Fast:
1-888-GET2FOX, ext. 289
Fax: 941-693-1554
http://www.foxonline.com/ <http://www.foxonline.com/>
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