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January 2005

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Subject:	Re: Pad Geometry for lead free
From:	Susy Webb <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Fri, 14 Jan 2005 10:47:41 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (35 lines)

Leaving the room.... good call! grin!
It is my understanding that the corners need to be rounded and the pads slightly smaller because the lead free solder does not spread out as easily and evenly, but I know that there are differing opinions on that from the experts at the conferences.  Me...I am going to wait for the dust to settle!

Regards,
Susy

>
> From: Fred Dark <[log in to unmask]>
> Date: 2005/01/14 Fri AM 09:29:00 CST
> To: [log in to unmask]
> Subject: [DC] Pad Geometry for lead free
>
> Hello All, I have a small question... ha ha... For lead free assembly will there be issues with pad geometries being different from today's technology and when lead free is implemented...
>
> I'm leaving the room... Fred Dark Jr.
>
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