Hi,
I'm working on a board that has a shortage of real estate.
By far the best placement (electrically, ease of assembly etc.) for a large
through hole cap and a 14-pin SOIC on this board would be to have the IC
directly underneath the CAP.
The IC would get reflowed with the other SMDs, and then the CAP would get
waved with the other THDs.
I plan to add vias (and maybe even the silkscreen) on the bottom so that all
the pads can be probed.
My question is if this is a bad practice?  Will the IC have contaminates
trapped on it during assembly because of the CAP?  Environmental issues
aren't a concern, and there is no chance of anything shorting in this
orientation.
I hope it's OK to do this.
Any answers are greatly appreciated.
Thanks,
Richard

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