Hi all,
 
The combined design/fab/assembly conference in Anaheim this year was an
outstanding success, and is scheduled to run again in a similar format
next year. This one will be a global event - the World Electronic
Circuits Council (WECC) runs one every three years as the main
organising body and will use IPC resources for organisation within the
US. In other words, our annual Expo/Apex/Summit will be in Anaheim in
February 2005 and run as a global event. Three years ago it was in
Cologne Germany.
 
We need design papers for this event. Abstracts for papers for fab and
assembly are being received from all over the world, but we're short of
design papers. So if you have a topic you're very familiar with, have
deep and insightful knowledge about, and want to achieve fame by
presenting your paper at a global conference, now is the time to act. 
 
There's a wealth of stuff for more details at
 
http://www.ipcprintedcircuitexpo.org/
 
Abstract receipts close May 1st so now is the time to act. 
 
Just think - a global forum for your speciality - what an opportunity,
and one not to be missed.
 
 
Andy Kowalewski
Chairman, IC Designers Council
 
SyChip Inc
Phone (972) 202 8852

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