Does anyone have the IPC specification which supports the documentation of
the layer assignment as illustrated below.  I learned this from my IPC
training, but I just cannot find the supporting documentation.

Thanks,

David Baldwin C.I.D.+



The following data shall appear on all film layer, just outside the board
outline or within a title block:

a) Each layers' description and layer number:  EXAMPLE:  These layer
numbers are based upon a 6 layer board with components on both
sides.  Actual numbers will vary for boards of different layers.

i)     Primary Side Layer 1
ii)    Power Plane Layer 2
iii)    Internal Trace Layer 3
iv)    Internal Trace Layer 4
v)     Ground Plane Layer 5
vi)    Secondary Side Layer 6
vii)   Silkscreen Primary Layer 7
viii)  Solder Mask Primary Layer 8
ix)   Solder Mask Secondary Layer 9
x)    Silkscreen Secondary Layer 10
xi)   SMD Paste Mask primary Layer 11
xii)  SMD Paste Mask primary Layer 12

___________________________________________________
Baldwin Technologies - 1736 S. Nevada Way - Suite B
Mesa, AZ  85204  (480) 539-4400
http://www.baldwin-tech.com

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