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August 2001

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Subject:
From:
Rich Schutz <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Wed, 1 Aug 2001 14:50:30 -0400
Content-Type:
text/plain
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text/plain (78 lines)
Mark,

We add .020" to the outside pad edge for all chip resistors including
0603's. Design the lands per IPC then add the extra pad. Do not change the
Z-span
of the pads. You want the extra pad on the ends to prevent shadowing. This
can also be applied to Chip capacitors, but add .030" to the edges.


(Embedded image moved to file: pic28145.pcx)
S = .020"  Resistors

S = .030" Capacitors




                    Mark Yankee
                    <Mark.Yankee@PU        To:     [log in to unmask]
                    LSE.COM>               cc:
                    Sent by:               Subject:     [DC] Wave soldering 0603 components
                    DesignerCouncil
                    <DesignerCounci
                    [log in to unmask]>


                    08/01/01 01:02
                    PM
                    Please respond
                    to
                    "DesignerCounci
                    l E-Mail
                    Forum."; Please
                    respond to Mark
                    Yankee






Hello,

I am trying to come up with a footprint pattern for wave soldering 0603
components.

Does anyone out there wave solder 0603's and can you provide a land design
(that's if it is not proprietary) or direct me to where I could find that
information?

Thanks in advance.

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Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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