Howdy everyone,
The vendor that gave me the most help with designing boards for ICT
specified that the vias needed to be soldermasked over the bottom side
only.  This is what I've been doing for a few years now.  I know there
are concerns about corrosion in the barrels when vias are capped on one
side only, and I was going to search for articles on this, but in the
meantime, it would be great to hear some "real-world" knowledge on this.
 The problem sounded very substantial from what I have gleaned.  Thanks
for any input on this subject.
Richard